Tokyo – May 28, 2025 – TOPPAN Inc. (TOPPAN), a TOPPAN Group company and wholly owned subsidiary of TOPPAN Holdings Inc. (TYO: 7911), will participate in JPCA Show 2025, which will be held at the Tokyo Big Sight international exhibition center from June 4 to 6.

JPCA Show enjoys a high profile both in Japan and overseas. It showcases the latest content and solutions, including electronic circuits, mounting technologies, sensors, and wearable technologies and aims to provide technical insights and new ideas to contribute to the growth of the electronic circuit sector and related industries.

The TOPPAN booth at JPCA Show 2025 will present FC-BGA substrates as well as technologies and components for next-generation semiconductor packaging.

Main Solutions on Show

1) FC-BGA substrates

Flip Chip-Ball Grid Array (FC-BGA) substrates are high-density semiconductor packaging substrates that enable enhanced speed and multifunctionality for LSI chips. They are used in sectors ranging from industrial equipment to consumer products and particularly for digital devices with large numbers of I/Os (signal counts). The TOPPAN booth at JPCA Show will feature FC-BGA substrates applied in advanced LSI for generative AI and communication devices, including FC-BGAs for next-generation semiconductor packaging that supports chiplet structures,¹ as well as high-speed data transmission FC-BGAs for close mounting of optical devices and LSI.

2) Next-generation semiconductor packaging

The constantly evolving functions of generative AI are driving increasing complexity in LSI data processing. It is becoming difficult to support higher levels of integration and expanded transmission bands with conventional FC-BGAs. TOPPAN is therefore focusing efforts on developing next-generation semiconductor packaging using glass and organic materials. The TOPPAN booth will showcase advanced semiconductor packaging components and technologies, including glass panel substrates with through-glass vias and high-precision cavities,² as well as coreless organic RDL interposers.³

About JPCA Show 2025

・Dates & times: June 4 to 6, 2025 10:00—17:00
・Venue: Tokyo Big Sight, East Hall 7
　*TOPPAN will participate in JPCA Show 2025 (East Hall 7/booth 7D-02)
・Organizer: Japan Electronics Packaging and Circuits Association
・Official website: https://www.jpcashow.com/show2025/en/index.html

About the TOPPAN Group

Established in Tokyo in 1900, the TOPPAN Group is a leading and diversified global provider committed to delivering sustainable, integrated solutions in fields including printing, communications, security, packaging, décor materials, electronics, and digital transformation. The TOPPAN Group’s global team of more than 50,000 employees offers optimal solutions enabled by industry-leading expertise and technologies to address the diverse challenges of every business sector and society and contribute to the achievement of shared sustainability goals.
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