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NEWS RELEASE
TOPPAN Develops Coreless Organic Interposer for Next-Generation Semiconductors—World’s First Supporting Standalone Electrical Inspection
Contributing to significant reduction in loss from chip disposal caused by interposer defects
INFORMATION
TOPPAN at JPCA Show 2024
Showcasing latest development efforts in semiconductor packaging technology
TOPICS
TOPPAN and TOPPAN Edge Enhance e-Platch™ Smart Inspection Support Service with Sensor for Remote Detection of Water, Chemical, and Oil Leakages
Equipped with communication function for connectivity in any location. Printed sensor used as detection band to enable wider range of liquid leakage detection. Service to be expanded to make initial implementation easier.
INFORMATION
TOPPAN to Participate in Kumamoto Industrial Revitalization Expo 2024
Supporting Kumamoto with DX solutions and manufacturing as the region is revitalized by the semiconductor industry
NEWS RELEASE
Toppan Photomask Signs Agreement with IBM for Joint R&D on Semiconductor EUV Photomasks
Advancing development of EUV photomasks for IBM’s 2 nanometer technology designs
NEWS RELEASE
TOPPAN to Build Line for Development and Mass Production of Next-Generation Semiconductor Packages in Ishikawa, Japan
Purchasing land and plant at JOLED Nomi Site as a new base