Aug 06, 2013
Conclusion of Agreement to Transfer Shares of NEC Toppan Circuit Solutions, Inc.
Toppan Printing Co., Ltd. (hereafter "Toppan Printing"; head office: Chiyoda Ward, Tokyo; President & Representative Director: Shingo Kaneko), NEC Corporation and Kyocera Corporation (hereafter “Kyocera”) have entered into a share transfer agreement to transfer to Kyocera all shares of NEC Toppan Circuit Solutions, Inc. (hereafter “TNCSi“; head office Minato Ward, Tokyo; President: Keiji Miyajima), a Toppan Printing subsidiary that manufactures printed wiring boards.
Overview of the agreement:
1. Content: Share transfer agreement pertaining to NEC Toppan Circuit Solutions, Inc.
2. Contracting parties: Kyocera Corporation, Toppan Printing Co., Ltd. and NEC Corporation
3. Date of agreement: August 6, 2013
4. Target company:
Company name: NEC Toppan Circuit Solutions, Inc.
Shareholders: Toppan Printing Co., Ltd. 55%; NEC Corporation 45%
Operations: Printed wiring boards including industrial use multilayer, consumer use build-up and module types
5. Schedule:
October 1, 2013: All TNCSi shares to be transferred to Kyocera Corporation.
October 1, 2013: Kyocera Corporation to acquire 100% ownership of TNCSi.
6. Objective:
Toppan Printing conducts semiconductor-related business including the manufacture of photomasks, in which the Company enjoys a large global market share, and package substrates.
This reorganization will enable Toppan to concentrate management resources on the FC-BGA substrate market, which is considered to have significant growth potential due to factors such as the miniaturization of semiconductors. Toppan will pursue further expansion of its semiconductor-related business by providing customers with a comprehensive service from photomasks used in frontend processes of semiconductor manufacture to package substrates for backend processes.
7. Impact on consolidated business performance:
There will be no change to the Toppan Group’s consolidated business forecast for the year ending March 31, 2014 due to this deal.
1. Content: Share transfer agreement pertaining to NEC Toppan Circuit Solutions, Inc.
2. Contracting parties: Kyocera Corporation, Toppan Printing Co., Ltd. and NEC Corporation
3. Date of agreement: August 6, 2013
4. Target company:
Company name: NEC Toppan Circuit Solutions, Inc.
Shareholders: Toppan Printing Co., Ltd. 55%; NEC Corporation 45%
Operations: Printed wiring boards including industrial use multilayer, consumer use build-up and module types
5. Schedule:
October 1, 2013: All TNCSi shares to be transferred to Kyocera Corporation.
October 1, 2013: Kyocera Corporation to acquire 100% ownership of TNCSi.
6. Objective:
Toppan Printing conducts semiconductor-related business including the manufacture of photomasks, in which the Company enjoys a large global market share, and package substrates.
This reorganization will enable Toppan to concentrate management resources on the FC-BGA substrate market, which is considered to have significant growth potential due to factors such as the miniaturization of semiconductors. Toppan will pursue further expansion of its semiconductor-related business by providing customers with a comprehensive service from photomasks used in frontend processes of semiconductor manufacture to package substrates for backend processes.
7. Impact on consolidated business performance:
There will be no change to the Toppan Group’s consolidated business forecast for the year ending March 31, 2014 due to this deal.
[Reference]
-Overview of NEC Toppan Circuit Solutions, Inc.:
-Company name: NEC Toppan Circuit Solutions, Inc.
-Established: October 1, 2002
-Headquarters: 19-26 Shibaura 3-chome, Minato Ward, Tokyo
-Representative: Keiji Miyajima, President
-Operations: Development, design, manufacture and sales of printed wiring boards
-Capital: 1 billion yen
-Investment ratios: Toppan Printing Co., Ltd. 55%; NEC Corporation 45%
-Number of employees: Non-consolidated: 769; Consolidated: 1,133 (as of July 31, 2013)
-Main facilities:
Manufacturing plants: Japan (Niigata, Toyama), the Philippines
Sales offices: Four in Japan – Tokyo (Shibaura, Fuchu), Nagoya, Osaka, Two overseas – U.S. (San Diego, San Jose)
-Overview of NEC Toppan Circuit Solutions, Inc.:
-Company name: NEC Toppan Circuit Solutions, Inc.
-Established: October 1, 2002
-Headquarters: 19-26 Shibaura 3-chome, Minato Ward, Tokyo
-Representative: Keiji Miyajima, President
-Operations: Development, design, manufacture and sales of printed wiring boards
-Capital: 1 billion yen
-Investment ratios: Toppan Printing Co., Ltd. 55%; NEC Corporation 45%
-Number of employees: Non-consolidated: 769; Consolidated: 1,133 (as of July 31, 2013)
-Main facilities:
Manufacturing plants: Japan (Niigata, Toyama), the Philippines
Sales offices: Four in Japan – Tokyo (Shibaura, Fuchu), Nagoya, Osaka, Two overseas – U.S. (San Diego, San Jose)
