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NEWS RELEASE
TOPPAN to Launch New FC-BGA Substrate Line at Niigata Plant
Bolstering high-end substrate production capabilities to meet semiconductor needs for AI and data centers
NEWS RELEASE
TOPPAN to Install Pilot Line for Advanced Semiconductor Packaging at Ishikawa Plant
Driving R&D of glass components for scaling of semiconductor packaging substrates
INFORMATION
TOPPAN and Tekscend Photomask Participate in SEMICON Japan 2025
Showcasing semiconductor photomasks, advanced semiconductor packaging utilizing large glass panels, and FC-BGA substrates supporting high-performance semiconductors
TOPICS
TOPPAN Group Launches Hybrid Line Manufacturing BOPP and BOPE Films for Sustainable Packaging
TOPPAN Speciality Films boosts film production capacity by 40% to meet rising global demand
INFORMATION
TOPPAN to Join CPHI Frankfurt 2025
Showcasing TOPPAN’s global supply chain and high-value-added packaging at leading international event for the pharmaceutical sector
NEWS RELEASE
TOPPAN Group Launches Business Supporting Sales of Japanese Anime and Manga Merchandise in UK
Developing distribution networks and ensuring effective content management to achieve seamless supply to local retailers and greater exposure to Japanese culture in the UK
INFORMATION
TOPPAN at JPCA Show 2025
Showcasing FC-BGA substrates and next-generation semiconductor packaging
INFORMATION
TOPPAN’s Dualsurf™ Film Wins at 2025 Display Industry Awards
Recognized for innovative technology that brings new possibilities to the appearance of displays
INFORMATION
TOPPAN at interzum 2025
Showcasing the latest décor material designs, eco-friendly decorative sheets for a sustainable society, and printing technologies for the future at leading trade fair for furniture production and interior design
INFORMATION
TOPPAN’s Niigata Plant Awarded Platinum Status in RBA VAP Audit
Maximum score achieved in the areas of Labor, Health and Safety, Environment, Ethics, and Supply Chain Management
INFORMATION
TOPPAN Joins AUTOMOTIVE WORLD 2025
Showcasing TOPPAN Group electronics products that address challenges in the automotive sector, including light control film for vehicles, the latest small and medium-sized LCDs, and electromagnetic wave control solutions
TOPICS
TOPPAN Announces Participation in US-JOINT Consortium for Next-generation Semiconductor Packaging
Collaborating with US and Japanese material and equipment manufacturers in Silicon Valley to deliver the best solutions for advanced semiconductor packaging
INFORMATION
TOPPAN to Participate in Guangzhou Designweek 2024
Showcasing the latest décor material designs, diverse applications, and a redesigned global website
INFORMATION
TOPPAN Inc. at Automotive Interiors Expo 2024
Presenting products for vehicle interiors to the European automotive market
INFORMATION
Cross Media to Hold HYPER JAPAN FESTIVAL 2024 in London
“Bringing Japan’s Wonders to the World” at comprehensive showcase for fans of Japan and its diverse culture in the UK
NEWS RELEASE
TOPPAN Develops Coreless Organic Interposer for Next-Generation Semiconductors—World’s First Supporting Standalone Electrical Inspection
Contributing to significant reduction in loss from chip disposal caused by interposer defects
INFORMATION
TOPPAN Group to Join The Pharma Days
Showcasing DX and SX solutions to the healthcare and pharmaceutical industry
TOPICS
TOPPAN and TOPPAN Edge Enhance e-Platch™ Smart Inspection Support Service with Sensor for Remote Detection of Water, Chemical, and Oil Leakages
Equipped with communication function for connectivity in any location. Printed sensor used as detection band to enable wider range of liquid leakage detection. Service to be expanded to make initial implementation easier.