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INFORMATION
TOPPAN Holdings Develops High-performance, Compact 3D ToF Sensor with Low Power Consumption
For wide range of applications including food serving robots, robot vacuums, and smart glasses
TOPICS
TOPPAN Digital, NICT, and ISARA Develop Smart Card System Employing Hybrid Methodology to Support Post-Quantum Cryptography and Current Public-key Cryptography
Facilitating a smooth transition to post-quantum cryptography to ensure the safety and security of social infrastructure
NEWS RELEASE
TOPPAN Develops Coreless Organic Interposer for Next-Generation Semiconductors—World’s First Supporting Standalone Electrical Inspection
Contributing to significant reduction in loss from chip disposal caused by interposer defects
INFORMATION
TOPPAN at JPCA Show 2024
Showcasing latest development efforts in semiconductor packaging technology
TOPICS
TOPPAN and TOPPAN Edge Enhance e-Platch™ Smart Inspection Support Service with Sensor for Remote Detection of Water, Chemical, and Oil Leakages
Equipped with communication function for connectivity in any location. Printed sensor used as detection band to enable wider range of liquid leakage detection. Service to be expanded to make initial implementation easier.
TOPICS
TOPPAN to Launch Indian Production of BOPP-based GL-SP Barrier Film for Sustainable Packaging
Achieving high level of competitiveness with end-to-end production of both base film and barrier film and catering to mono-material needs by applying transparent barrier to BOPP substrate