Tokyo – March 2, 2026 – TOPPAN Inc. (TOPPAN), a TOPPAN Group company and wholly owned subsidiary of TOPPAN Holdings Inc. (TYO: 7911), will join embedded world 2026, Europe’s largest embedded technology exposition and conference, in Nuremberg, Germany, from March 10 through 12.
The TOPPAN booth (Hall 4, Booth 4-573) aims to increase awareness about the company’s semiconductor design capabilities and to attract new clients by showcasing semiconductor design and turnkey services*1.
TOPPAN Exhibit Focus
ASIC design & turnkey services, and power semiconductor turnkey services
For over 50 years TOPPAN has provided ASIC*2 services primarily for industrial and commercial use. Specializing in ASICs for servo encoder control, motor control, and factory automation (FA), TOPPAN meets the demands of Japanese manufacturers while maintaining certified partnerships with world-class foundries and IP providers. The company offers end-to-end support from initial specifications to mass production management to deliver high-quality custom chips. TOPPAN also provides flexible solutions for FPGA-to-ASIC conversion, low-power design, End-of-Life (EOL) management, and small-batch production. The company leverages expertise in mixed-signal (analog/digital) design to provide these solutions at the high quality and reliability standards required by the European market.
In recent years, TOPPAN has also started a similar turnkey service for power semiconductors and is developing physical AI solutions and data center power supply solutions. The TOPPAN booth will showcase sample devices alongside the company’s extensive track record.
High-precision metal etching
Metal microfabrication can generate various patterns using photolithography and etching techniques. TOPPAN uses roll-to-roll processing, which is suitable for mass production and facilitates the production of high-precision etched products consistently at a reasonable cost. Visitors will be able to view samples at the TOPPAN booth.
Multispectral sensing and metasurface optics
TOPPAN’s booth will showcase multispectral sensing technology capable of capturing a broad spectrum from visible light to short-wave infrared (SWIR) on a single chip. The booth will also feature the game-changing metasurface (LWIR)*3 lens. Combining advanced identification techniques and the miniaturization of devices, TOPPAN aims to integrate intelligent vision into all industries, including food production, medicine, infrastructure and more.
embedded world 2026
Dates: March 10-12, 2026
Time: 09:00-18:00 *Latest entry 17:00
Venue: NürnbergMesse
TOPPAN Group booth: Hall 4, Booth 4-573
Organizer: NürnbergMesse GmbH
Official website: https://www.embedded-world.de/en
2 ASIC: An integrated circuit (IC) designed and manufactured specifically for a particular device or application. Compared to general-purpose ICs, ASICs offer superior processing speeds, smaller footprints, reduced power consumption, and the ability to protect proprietary technology through hardware-level security.
3 Metasurface (LWIR): A 'flat lens' with no physical curvature that bends light using microscopic structures smaller than the wavelength itself. By using silicon (Si), which is transparent to infrared light, it is possible to dramatically reduce the thickness and weight of long-wave infrared lenses.
About the TOPPAN Group
Established in Tokyo in 1900, the TOPPAN Group is a leading and diversified global provider committed to delivering sustainable, integrated solutions in fields including printing, communications, security, packaging, décor materials, electronics, and digital transformation. The TOPPAN Group’s global team of more than 50,000 employees offers optimal solutions enabled by industry-leading expertise and technologies to address the diverse challenges of every business sector and society and contribute to the achievement of shared sustainability goals.
https://www.holdings.toppan.com/en/
https://www.linkedin.com/company/toppan/
