TOPPAN NewsRoom
Latest News
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TOPPAN to Launch New FC-BGA Substrate Line at Niigata Plant
Bolstering high-end substrate production capabilities to meet semiconductor needs for AI and data centers -
TOPPAN to Install Pilot Line for Advanced Semiconductor Packaging at Ishikawa Plant
Driving R&D of glass components for scaling of semiconductor packaging substrates -
TOPPAN Holdings Acquires Asahi Kasei’s Patented Brittle Lidding Material Technology for Push-through Blister Packs
Driving a shift to aluminum-free and mono-material push-through blister packs for tablets and capsules
